ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM. IEEE. 2017. (EDAPS 2017) (USB)

ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM. IEEE. 2017. (EDAPS 2017) (USB)

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038126
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  • Title: 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2017)
  • Date/Location: Held 14-16 December 2017, Haining, Hangzhou, China.
  • IEEE #: CFP17EDP-USB
  • ISBN: 9781538612378
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2018 )

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  • Title: 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2017)
  • Date/Location: Held 14-16 December 2017, Haining, Hangzhou, China.
  • IEEE #: CFP17EDP-USB
  • ISBN: 9781538612378
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2018 )