Details
- Title: 2017 10th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2017)
- Date/Location: Held 14-16 October 2017, Shanghai, China.
- IEEE #: CFP17J14-POD
- ISBN: 9781538619384
- Pages: 2,352 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 10th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2017)
- Date/Location: Held 14-16 October 2017, Shanghai, China.
- IEEE #: CFP17J14-POD
- ISBN: 9781538619384
- Pages: 2,352 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2018 )