Details
- Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
- Subtitle: 223rd ECS Meeting
- Date/Location: Held 12-16 May 2013, Toronto, Canada.
- Series: ECS Transactions Volume 53 No.03
- Editor: Roozeboom, F. et al.
- ISBN: 9781623320256
- Pages: 267 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( May 2018 )
Description
Members/Attendees
Tab 4
- Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
- Subtitle: 223rd ECS Meeting
- Date/Location: Held 12-16 May 2013, Toronto, Canada.
- Series: ECS Transactions Volume 53 No.03
- Editor: Roozeboom, F. et al.
- ISBN: 9781623320256
- Pages: 267 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( May 2018 )