Details
- Title: 2017 21st European Microelectronics and Packaging Conference (EMPC 2017) & Exhibition
- Date/Location: Held 10-13 September 2017, Warsaw, Poland.
- IEEE #: CFP1754H-POD
- ISBN: 9781538623091
- Pages: 534 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 21st European Microelectronics and Packaging Conference (EMPC 2017) & Exhibition
- Date/Location: Held 10-13 September 2017, Warsaw, Poland.
- IEEE #: CFP1754H-POD
- ISBN: 9781538623091
- Pages: 534 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )