THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 19TH 2018. (EuroSimE 2018)

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039563

$141.50 - $283.00

Details

Title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2018)
Date/Location: Held 15-18 April 2018, Toulouse, France.
IEEE #: CFP18566-POD
ISBN: 9781538623602
Pages: 613 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jun 2018 )

Title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2018)
Date/Location: Held 15-18 April 2018, Toulouse, France.
IEEE #: CFP18566-POD
ISBN: 9781538623602
Pages: 613 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jun 2018 )