THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 19TH 2018. (EuroSimE 2018) (USB)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 19TH 2018. (EuroSimE 2018) (USB)

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039564
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  • Title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2018)
  • Date/Location: Held 15-18 April 2018, Toulouse, France.
  • IEEE #: CFP18566-USB
  • ISBN: 9781538623589
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2018 )

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  • Title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2018)
  • Date/Location: Held 15-18 April 2018, Toulouse, France.
  • IEEE #: CFP18566-USB
  • ISBN: 9781538623589
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2018 )