ELECTROMAGNETIC COMPATIBILITY. IEEE INTERNATIONAL SYMPOSIUM. 2018. (EMC/APEMC 2018) (2 VOLS IN 3 PARTS) (AND IEEE ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNET COMPATIBILITY)

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  • Title: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC 2018)
  • Date/Location: Held 14-18 May 2018, Suntec City, Singapore.
  • IEEE #: CFP18EMC-POD
  • ISBN: 9781509039555
  • Pages: 1,486 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )

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  • Title: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC 2018)
  • Date/Location: Held 14-18 May 2018, Suntec City, Singapore.
  • IEEE #: CFP18EMC-POD
  • ISBN: 9781509039555
  • Pages: 1,486 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )