Details
- Title: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC 2018)
- Date/Location: Held 14-18 May 2018, Suntec City, Singapore.
- IEEE #: CFP18EMC-POD
- ISBN: 9781509039555
- Pages: 1,486 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC 2018)
- Date/Location: Held 14-18 May 2018, Suntec City, Singapore.
- IEEE #: CFP18EMC-POD
- ISBN: 9781509039555
- Pages: 1,486 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )