Details
- Title: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2018)
- Date/Location: Held 13-17 May 2018, Chicago, Illinois, USA.
- IEEE #: CFP18ISP-POD
- ISBN: 9781538629284
- Pages: 523 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2018)
- Date/Location: Held 13-17 May 2018, Chicago, Illinois, USA.
- IEEE #: CFP18ISP-POD
- ISBN: 9781538629284
- Pages: 523 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2018 )