Details
- Title: 2018 IEEE International Interconnect Technology Conference (IITC 2018)
- Date/Location: Held 4-7 June 2018, Santa Clara, California, USA.
- IEEE #: CFP18ITR-POD
- ISBN: 9781538643389
- Pages: 187 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE International Interconnect Technology Conference (IITC 2018)
- Date/Location: Held 4-7 June 2018, Santa Clara, California, USA.
- IEEE #: CFP18ITR-POD
- ISBN: 9781538643389
- Pages: 187 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )