Details
- Title: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2018)
- Date/Location: Held 16-19 July 2018, Singapore.
- IEEE #: CFP18777-POD
- ISBN: 9781538649305
- Pages: 664 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2018)
- Date/Location: Held 16-19 July 2018, Singapore.
- IEEE #: CFP18777-POD
- ISBN: 9781538649305
- Pages: 664 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2018 )