Details
- Title: 2018 International Conference on Platform Technology and Service (PlatCon 2018)
- Date/Location: Held 29-31 January 2018, Jeju, South Korea.
- IEEE #: CFP18B77-POD
- ISBN: 9781538647110
- Pages: 227 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Conference on Platform Technology and Service (PlatCon 2018)
- Date/Location: Held 29-31 January 2018, Jeju, South Korea.
- IEEE #: CFP18B77-POD
- ISBN: 9781538647110
- Pages: 227 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2018 )