Details
- Title: 2018 19th International Conference on Electronic Packaging Technology (ICEPT 2018)
- Date/Location: Held 8-11 August 2018, Shanghai, China.
- IEEE #: CFP18553-POD
- ISBN: 9781538663875
- Pages: 1,750 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 19th International Conference on Electronic Packaging Technology (ICEPT 2018)
- Date/Location: Held 8-11 August 2018, Shanghai, China.
- IEEE #: CFP18553-POD
- ISBN: 9781538663875
- Pages: 1,750 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )