Details
- Title: 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC 2018)
- Date/Location: Held 6-8 June 2018, Shenzhen, China.
- IEEE #: CFP18754-POD
- ISBN: 9781538662359
- Pages: 258 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC 2018)
- Date/Location: Held 6-8 June 2018, Shenzhen, China.
- IEEE #: CFP18754-POD
- ISBN: 9781538662359
- Pages: 258 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )