Details
- Title: 2018 IEEE Technology and Engineering Management Conference (TEMSCON 2018)
- Date/Location: Held 28 June - 1 July 2018, Evanston, Illinois, USA.
- IEEE #: CFP18G19-POD
- ISBN: 9781538620489
- Pages: 403 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Technology and Engineering Management Conference (TEMSCON 2018)
- Date/Location: Held 28 June - 1 July 2018, Evanston, Illinois, USA.
- IEEE #: CFP18G19-POD
- ISBN: 9781538620489
- Pages: 403 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2018 )