SYSTEM LEVEL INTERCONNECT PREDICTION. ACM/IEEE INTERNATIONAL WORKSHOP. 2018. (SLIP 2018)

SYSTEM LEVEL INTERCONNECT PREDICTION. ACM/IEEE INTERNATIONAL WORKSHOP. 2018. (SLIP 2018)

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041460
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  • Title: 2018 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2018)
  • Date/Location: Held 23 June 2018, San Francisco, California, USA.
  • IEEE #: CFP18SLP-POD
  • ISBN: 9781450359009
  • Pages: 42 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2018 )

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  • Title: 2018 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2018)
  • Date/Location: Held 23 June 2018, San Francisco, California, USA.
  • IEEE #: CFP18SLP-POD
  • ISBN: 9781450359009
  • Pages: 42 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2018 )