Details
- Title: 2018 International Conference on Machine Learning and Cybernetics (ICMLC 2018)
- Date/Location: Held 15-18 July 2018, Chengdu, China.
- IEEE #: CFP18523-POD
- ISBN: 9781538652152
- Pages: 678 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Conference on Machine Learning and Cybernetics (ICMLC 2018)
- Date/Location: Held 15-18 July 2018, Chengdu, China.
- IEEE #: CFP18523-POD
- ISBN: 9781538652152
- Pages: 678 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )