Details
- Title: 2018 13th International Congress Molded Interconnect Devices (MID 2018)
- Date/Location: Held 25-26 September 2018, Wurzburg, Germany.
- IEEE #: CFP18J74-POD
- ISBN: 9781538649343
- Pages: 134 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 13th International Congress Molded Interconnect Devices (MID 2018)
- Date/Location: Held 25-26 September 2018, Wurzburg, Germany.
- IEEE #: CFP18J74-POD
- ISBN: 9781538649343
- Pages: 134 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2018 )