Details
- Title: 2018 IEEE International Symposium on Haptic, Audio and Visual Environments and Games (HAVE 2018)
- Date/Location: Held 20-21 September 2018, Dalian, China.
- IEEE #: CFP18HAV-POD
- ISBN: 9781538658390
- Pages: 67 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE International Symposium on Haptic, Audio and Visual Environments and Games (HAVE 2018)
- Date/Location: Held 20-21 September 2018, Dalian, China.
- IEEE #: CFP18HAV-POD
- ISBN: 9781538658390
- Pages: 67 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2018 )