Details
- Title: 2018 IEEE 22nd International Enterprise Distributed Object Computing Workshop (EDOCW 2018)
- Date/Location: Held 16-19 October 2018, Stockholm, Sweden.
- IEEE #: CFP1825H-POD
- ISBN: 9781538641422
- Pages: 230 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE 22nd International Enterprise Distributed Object Computing Workshop (EDOCW 2018)
- Date/Location: Held 16-19 October 2018, Stockholm, Sweden.
- IEEE #: CFP1825H-POD
- ISBN: 9781538641422
- Pages: 230 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )