Details
- Title: 2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO 2018)
- Date/Location: Held 20-24 October 2018, Fukuoka, Japan.
- IEEE #: CFP18071-POD
- ISBN: 9781538662410
- Pages: 987 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO 2018)
- Date/Location: Held 20-24 October 2018, Fukuoka, Japan.
- IEEE #: CFP18071-POD
- ISBN: 9781538662410
- Pages: 987 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )