Details
- Title: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME 2018)
- Date/Location: Held 25-28 October 2018, Iasi, Romania.
- IEEE #: CFP1807I-POD
- ISBN: 9781538655788
- Pages: 403 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME 2018)
- Date/Location: Held 25-28 October 2018, Iasi, Romania.
- IEEE #: CFP1807I-POD
- ISBN: 9781538655788
- Pages: 403 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )