Details
- Title: 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)
- Date/Location: Held 24-26 November 2018, Shanghai, China.
- IEEE #: CFP18H23-POD
- ISBN: 9781538683125
- Pages: 405 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)
- Date/Location: Held 24-26 November 2018, Shanghai, China.
- IEEE #: CFP18H23-POD
- ISBN: 9781538683125
- Pages: 405 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )