Details
- Title: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2018)
- Date/Location: Held 24-26 October 2018, Taipei, Taiwan.
- IEEE #: CFP1859B-POD
- ISBN: 9781538656167
- Pages: 318 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2018)
- Date/Location: Held 24-26 October 2018, Taipei, Taiwan.
- IEEE #: CFP1859B-POD
- ISBN: 9781538656167
- Pages: 318 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )