ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM. IEEE. 2018. (EDAPS 2018) (USB)

ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM. IEEE. 2018. (EDAPS 2018) (USB)

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047789
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  • Title: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018)
  • Date/Location: Held 16-18 December 2018, Chandigarh, India.
  • IEEE #: CFP18EDP-USB
  • ISBN: 9781538665916
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2019 )

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  • Title: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018)
  • Date/Location: Held 16-18 December 2018, Chandigarh, India.
  • IEEE #: CFP18EDP-USB
  • ISBN: 9781538665916
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2019 )