Details
- Title: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC 2018)
- Date/Location: Held 4-7 December 2018, Singapore.
- IEEE #: CFP18453-POD
- ISBN: 9781538676691
- Pages: 960 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC 2018)
- Date/Location: Held 4-7 December 2018, Singapore.
- IEEE #: CFP18453-POD
- ISBN: 9781538676691
- Pages: 960 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )