Details
- Title: 2018 20th International Conference on Electronic Materials and Packaging (EMAP 2018)
- Date/Location: Held 17-20 December 2018, Clear Water Bay, Hong Kong.
- IEEE #: CFP18506-POD
- ISBN: 9781538656433
- Pages: 187 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 20th International Conference on Electronic Materials and Packaging (EMAP 2018)
- Date/Location: Held 17-20 December 2018, Clear Water Bay, Hong Kong.
- IEEE #: CFP18506-POD
- ISBN: 9781538656433
- Pages: 187 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )