Details
- Title: 2018 IEEE Far East NDT New Technology & Application Forum (FENDT 2018)
- Date/Location: Held 6-8 July 2018, Xiamen, China.
- IEEE #: CFP1810U-POD
- ISBN: 9781538662311
- Pages: 197 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Far East NDT New Technology & Application Forum (FENDT 2018)
- Date/Location: Held 6-8 July 2018, Xiamen, China.
- IEEE #: CFP1810U-POD
- ISBN: 9781538662311
- Pages: 197 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )