SILICON COMPATIBLE EMERGING MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED CMOS AND POST-CMOS APPLICATIONS 9. (235TH ECS MEETING)

SILICON COMPATIBLE EMERGING MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED CMOS AND POST-CMOS APPLICATIONS 9. (235TH ECS MEETING)

Item #:
048860
$72.00 - $90.00
Adding to cart… The item has been added

Details

  • Title: Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9
  • Subtitle: 235th ECS Meeting
  • Date/Location: Held 26-30 May 2019, Dallas, Texas, USA.
  • Series: ECS Transactions Volume 89 No.3
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781510886476
  • Pages: 166 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jul 2019 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9
  • Subtitle: 235th ECS Meeting
  • Date/Location: Held 26-30 May 2019, Dallas, Texas, USA.
  • Series: ECS Transactions Volume 89 No.3
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781510886476
  • Pages: 166 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jul 2019 )