Details
- Title: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)
- Date/Location: Held 24-27 March 2019, Hannover, Germany.
- IEEE #: CFP19566-POD
- ISBN: 9781538680414
- Pages: 475 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)
- Date/Location: Held 24-27 March 2019, Hannover, Germany.
- IEEE #: CFP19566-POD
- ISBN: 9781538680414
- Pages: 475 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2019 )