THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 18TH 2019. (ITherm 2019) (USB)

THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 18TH 2019. (ITherm 2019) (USB)

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049496
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  • Title: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019)
  • Date/Location: Held 28-31 May 2019, Las Vegas, Nevada, USA.
  • IEEE #: CFP19ITH-USB
  • ISBN: 9781728124605
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2019 )

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  • Title: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019)
  • Date/Location: Held 28-31 May 2019, Las Vegas, Nevada, USA.
  • IEEE #: CFP19ITH-USB
  • ISBN: 9781728124605
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2019 )