Details
- Title: 2019 IEEE/ACM International Conference on Technical Debt (TechDebt 2019)
- Date/Location: Held 26-27 May 2019, Montreal, Quebec, Canada.
- IEEE #: CFP19P50-POD
- ISBN: 9781728133720
- Pages: 140 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE/ACM International Conference on Technical Debt (TechDebt 2019)
- Date/Location: Held 26-27 May 2019, Montreal, Quebec, Canada.
- IEEE #: CFP19P50-POD
- ISBN: 9781728133720
- Pages: 140 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )