Details
- Title: 2018 IEEE Symposium on Product Compliance Engineering - Asia (ISPCE-CN 2018)
- Date/Location: Held 5-7 December 2018, Shenzhen, China.
- IEEE #: CFP18BWD-POD
- ISBN: 9781728146270
- Pages: 123 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Symposium on Product Compliance Engineering - Asia (ISPCE-CN 2018)
- Date/Location: Held 5-7 December 2018, Shenzhen, China.
- IEEE #: CFP18BWD-POD
- ISBN: 9781728146270
- Pages: 123 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )