Details
- Title: 2019 International Wafer Level Packaging Conference (IWLPC 2019)
- Date/Location: Held 22-24 October 2019, San Jose, California, USA.
- IEEE #: CFP19WAF-POD
- ISBN: 9781728145839
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 International Wafer Level Packaging Conference (IWLPC 2019)
- Date/Location: Held 22-24 October 2019, San Jose, California, USA.
- IEEE #: CFP19WAF-POD
- ISBN: 9781728145839
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2020 )