Details
- Title: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2019)
- Date/Location: Held 25-27 September 2019, Lecco, Italy.
- IEEE #: CFP19TII-POD
- ISBN: 9781728120799
- Pages: 359 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2019)
- Date/Location: Held 25-27 September 2019, Lecco, Italy.
- IEEE #: CFP19TII-POD
- ISBN: 9781728120799
- Pages: 359 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )