SEMICONDUCTOR PACKAGING TECHNOLOGY SYMPOSIUM. 2014. PUSHING THE LIMITS IN PACKAGING DESIGN AND MANUFACTURING

SEMICONDUCTOR PACKAGING TECHNOLOGY SYMPOSIUM. 2014. PUSHING THE LIMITS IN PACKAGING DESIGN AND MANUFACTURING

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054734
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  • Title: Semiconductor Packaging Technology Symposium 2014
  • Subtitle: Pushing the Limits in Packaging Design and Manufacturing
  • Date/Location: Held 23 October 2014, Santa Clara, California, USA.
  • Series: MEPTEC Symposium Proceedings Number 58
  • ISBN: 9781713812821
  • Pages: 168 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )

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  • Title: Semiconductor Packaging Technology Symposium 2014
  • Subtitle: Pushing the Limits in Packaging Design and Manufacturing
  • Date/Location: Held 23 October 2014, Santa Clara, California, USA.
  • Series: MEPTEC Symposium Proceedings Number 58
  • ISBN: 9781713812821
  • Pages: 168 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )