SEMICONDUCTOR PACKAGING ROADMAP SYMPOSIUM. 2016. MEPTEC INITIATES COLLABORATION WITH HETEROGENEOUS INTEGRATION ROADMAP

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  • Title: Semiconductor Packaging Roadmap Symposium 2016
  • Subtitle: MEPTEC Initiates Collaboration with Heterogeneous Integration Roadmap
  • Date/Location: Held 14 November 2016, San Jose, California, USA.
  • Series: MEPTEC Symposium Proceedings Number 62
  • ISBN: 9781713812869
  • Pages: 177 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
  • POD Publisher: Curran Associates, Inc. ( Jan 2021 )

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  • Title: Semiconductor Packaging Roadmap Symposium 2016
  • Subtitle: MEPTEC Initiates Collaboration with Heterogeneous Integration Roadmap
  • Date/Location: Held 14 November 2016, San Jose, California, USA.
  • Series: MEPTEC Symposium Proceedings Number 62
  • ISBN: 9781713812869
  • Pages: 177 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
  • POD Publisher: Curran Associates, Inc. ( Jan 2021 )