Details
- Title: 2021 3rd International Symposium on Material and Electrical Engineering (ISMEE 2021)
- Date/Location: Held 10-11 November 2021, Bandung, Indonesia.
- IEEE #: CFP21BH9-POD
- ISBN: 9781728177335
- Pages: 355 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 3rd International Symposium on Material and Electrical Engineering (ISMEE 2021)
- Date/Location: Held 10-11 November 2021, Bandung, Indonesia.
- IEEE #: CFP21BH9-POD
- ISBN: 9781728177335
- Pages: 355 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2022 )