Details
- Title: Advanced 3D Interconnect Technologies and Packaging
- Subtitle: 242nd ECS Meeting
- Date/Location: Held 9-13 October 2022, Atlanta, Georgia, USA.
- Series: ECS Transactions Volume 109 No.02
- Editor: Obeng, Y. et al.
- ISBN: 9781713863458
- Pages: 52 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )
Description
Members/Attendees
Tab 4
- Title: Advanced 3D Interconnect Technologies and Packaging
- Subtitle: 242nd ECS Meeting
- Date/Location: Held 9-13 October 2022, Atlanta, Georgia, USA.
- Series: ECS Transactions Volume 109 No.02
- Editor: Obeng, Y. et al.
- ISBN: 9781713863458
- Pages: 52 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )