PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2022. (INTERPACK 2022)

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066892
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  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2022
  • Date/Location: Held 25-27 October 2022, Garden Grove, California, USA.
  • ISBN: 9780791886557
  • Pages: 613 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jan 2023 )

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Tab 4

 
  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2022
  • Date/Location: Held 25-27 October 2022, Garden Grove, California, USA.
  • ISBN: 9780791886557
  • Pages: 613 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jan 2023 )