ELECTRONICS, CIRCUITS AND INFORMATION ENGINEERING. INTERNATIONAL CONFERENCE. 3RD 2023. (ECIE 2023)

ELECTRONICS, CIRCUITS AND INFORMATION ENGINEERING. INTERNATIONAL CONFERENCE. 3RD 2023. (ECIE 2023)

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069745
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Details

  • Title: 3rd International Conference on Electronics, Circuits and Information Engineering (ECIE 2023)
  • Date/Location: Held 6-8 January 2023, Suzhou, China.
  • Series: Journal of Physics: Conference Series Volume 2537
  • ISBN: 9781713875369
  • Pages: 158 (1 Vol) (approx)
  • Format: Softcover
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2023 )

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  • Title: 3rd International Conference on Electronics, Circuits and Information Engineering (ECIE 2023)
  • Date/Location: Held 6-8 January 2023, Suzhou, China.
  • Series: Journal of Physics: Conference Series Volume 2537
  • ISBN: 9781713875369
  • Pages: 158 (1 Vol) (approx)
  • Format: Softcover
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2023 )