Details
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 17
- Subtitle: 244th ECS Meeting
- Date/Location: Held 8-12 October 2023, Gothenburg, Sweden.
- Series: ECS Transactions Volume 112 No.03
- Editor: Foumel, F. and Knechtel, R. et al.
- ISBN: 9781713880158
- Pages: 283 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 17
- Subtitle: 244th ECS Meeting
- Date/Location: Held 8-12 October 2023, Gothenburg, Sweden.
- Series: ECS Transactions Volume 112 No.03
- Editor: Foumel, F. and Knechtel, R. et al.
- ISBN: 9781713880158
- Pages: 283 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )