Details
- Title: 2024 IEEE ANDESCON
- Date/Location: Held 11-13 September 2024, Cusco, Peru.
- IEEE #: CFP2461J-POD
- ISBN: 9798350355291
- Pages: 724 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE ANDESCON
- Date/Location: Held 11-13 September 2024, Cusco, Peru.
- IEEE #: CFP2461J-POD
- ISBN: 9798350355291
- Pages: 724 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )