Details
- Title: *024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024)
- Date/Location: Held 22-25 October 2024, Taipei, Taiwan.
- IEEE #: CFP2459B-POD
- ISBN: 9798331532253
- Pages: 474 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2025 )
Description
Members/Attendees
Tab 4
- Title: *024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024)
- Date/Location: Held 22-25 October 2024, Taipei, Taiwan.
- IEEE #: CFP2459B-POD
- ISBN: 9798331532253
- Pages: 474 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2025 )