Details
- Title: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME 2024)
- Date/Location: Held 16-18 October 2024, Sibiu, Romania.
- IEEE #: CFP2407I-POD
- ISBN: 9798331539528
- Pages: 518 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME 2024)
- Date/Location: Held 16-18 October 2024, Sibiu, Romania.
- IEEE #: CFP2407I-POD
- ISBN: 9798331539528
- Pages: 518 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )