Details
- Title: 2024 IEEE XXXI International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2024)
- Date/Location: Held 6-8 November 2024, Lima, Peru.
- IEEE #: CFP24D62-POD
- ISBN: 9798350378351
- Pages: 461 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE XXXI International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2024)
- Date/Location: Held 6-8 November 2024, Lima, Peru.
- IEEE #: CFP24D62-POD
- ISBN: 9798350378351
- Pages: 461 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )