Details
- Title: 2024 International 3D Systems Integration Conference (3DIC 2024)
- Date/Location: Held 25-27 September 2024, Sendai, Japan.
- IEEE #: CFP24DIC-POD
- ISBN: 9798331516512
- Pages: 145 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 International 3D Systems Integration Conference (3DIC 2024)
- Date/Location: Held 25-27 September 2024, Sendai, Japan.
- IEEE #: CFP24DIC-POD
- ISBN: 9798331516512
- Pages: 145 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )