IMAGE AND SIGNAL PROCESSING, BIOMEDICAL ENGINEERING AND INFORMATICS. INTERNATIONAL CONGRESS. 17TH 2024. (CISP-BMEI 2024) (2 VOLS)

IMAGE AND SIGNAL PROCESSING, BIOMEDICAL ENGINEERING AND INFORMATICS. INTERNATIONAL CONGRESS. 17TH 2024. (CISP-BMEI 2024) (2 VOLS)

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079170
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Details

  • Title: 2024 17th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2024)
  • Date/Location: Held 26-28 October 2024, Shanghai, China.
  • IEEE #: CFP24J14-POD
  • ISBN: 9798331507404
  • Pages: 1,316 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2025 )

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  • Title: 2024 17th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2024)
  • Date/Location: Held 26-28 October 2024, Shanghai, China.
  • IEEE #: CFP24J14-POD
  • ISBN: 9798331507404
  • Pages: 1,316 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2025 )