Details
- Title: 2024 17th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2024)
- Date/Location: Held 26-28 October 2024, Shanghai, China.
- IEEE #: CFP24J14-POD
- ISBN: 9798331507404
- Pages: 1,396 (2 Vols) (approx)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 17th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2024)
- Date/Location: Held 26-28 October 2024, Shanghai, China.
- IEEE #: CFP24J14-POD
- ISBN: 9798331507404
- Pages: 1,396 (2 Vols) (approx)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )