Details
- Title: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC 2024)
- Date/Location: Held 3-6 December 2024, Singapore.
- IEEE #: CFP24453-POD
- ISBN: 9798331522018
- Pages: 1,277 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC 2024)
- Date/Location: Held 3-6 December 2024, Singapore.
- IEEE #: CFP24453-POD
- ISBN: 9798331522018
- Pages: 1,277 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )