Details
- Title: 2024 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2024)
- Date/Location: Held 17-19 December 2024, Bangalore, India.
- IEEE #: CFP24EDP-POD
- ISBN: 9798331543266
- Pages: 108 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2024)
- Date/Location: Held 17-19 December 2024, Bangalore, India.
- IEEE #: CFP24EDP-POD
- ISBN: 9798331543266
- Pages: 108 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )