2025 26TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME 2025)

Item #:

080357

$153.00 - $306.00

Details

Title: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2025)
Date/Location: Held 6-9 April 2025, Utrecht, Netherlands.
IEEE #: CFP25566-POD
ISBN: 9798350393019
Pages: 760 (1 Vol) (approx)
Format: Softcover
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Aug 2025 )

Title: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2025)
Date/Location: Held 6-9 April 2025, Utrecht, Netherlands.
IEEE #: CFP25566-POD
ISBN: 9798350393019
Pages: 760 (1 Vol) (approx)
Format: Softcover
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Aug 2025 )